Ansys expands collaboration with TSMC on design and process tools

Ansys HFSS-IC Pro SoC electromagnetic solution is certified for TSMC’s 5nm and 3nm process.

Ansys, in collaboration with TSMC, has introduced updates to its semiconductor tools, including AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs). The partnership also includes new tool certifications to support 3D integrated circuit (3D-IC) development and help meet design needs for AI and high-performance computing (HPC) applications. Additionally, Ansys and TSMC are expanding tool certification for the newly introduced N3C technology, based on the existing N3P design platform.

Ansys and TSMC continue to advance 3D-IC

A16 EM/IR and thermal certification

RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC’s advanced silicon process A16 with Super Power Rail, a best-in-class backside power delivery solution for analog/block-level and SoC-level electromigration (EM) and voltage drop (IR) analysis.

To ensure reliable thermal management for the TSMC A16 process, Ansys and TSMC developed a more precise thermal analysis flow. The enhanced method leverages TSMC’s thermal specifications, providing accurate temperature calculations, and enhancing performance in advanced applications. In addition, Ansys and TSMC continue collaborating on design enablement for TSMC’s next-generation A14 technology.


Advanced 5nm and 3nm on-chip electromagnetic certification

To address growing needs for scalable electromagnetic analysis, Ansys is introducing the HFSS-IC product family. HFSS-IC Pro, which incorporates RaptorX technology, has been certified by TSMC for its 5nm and 3nm process technologies. The certification supports the use of the tool in designing advanced semiconductor products for applications such as AI, high-performance computing, next-generation communications, and automotive electronics. 

AI-assisted photonic design optimization

Ansys and TSMC continue to refine COUPE design solutions by leveraging AI capabilities in Ansys optiSLang process integration and design optimization software. These solutions enable PIC optimization with Ansys Lumerical INTERCONNECT and empower optical coupling system optimization and robustness analysis with Ansys Zemax OpticStudio.

AI-assisted optimal RF design migration

TSMC, Ansys, and Synopsys have improved a joint AI-assisted workflow for RF integrated circuit migration. The solution combines Ansys HFSS-IC Pro AI technology with Synopsys Custom Compiler and ASO.ai tools to support the transition between silicon process nodes for analog and RF ICs. The workflow automates tasks such as device placement, routing optimization, and EM-aware tuning while maintaining design intent and performance. As process nodes advance, RF IC migration becomes more complex. Integrating AI helps address electromagnetic challenges, supporting signal integrity, power efficiency, and manufacturability. 

Multiphysics signoff analysis flow enablement

Ansys RedHawk-SC, RedHawk-SC Electrothermal, and Synopsys 3DIC Compiler are integrated into TSMC, Ansys, and Synopsys’ joint multiphysics signoff analysis flow enablement platform for extraction, timing, power, EM/IR, and thermal analysis. These analyses are linked through a shared data flow, supporting thermal-aware timing analysis and voltage-aware timing analysis. This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs.

For more information, visit ansys.com.