Siemens and TSMC are extending tool certifications to support the new TSMC N3C technology, following earlier N3P solutions.
Siemens Digital Industries Software has expanded its ongoing collaboration with TSMC to support semiconductor design and integration for advanced technologies. Siemens’ Calibre nmPlatform tools—nmDRC, nmLVS, Calibre YieldEnhancer, and PERC—along with its Analog FastSPICE (AFS) and Solido tools, are now certified for TSMC’s N2P and A16 process technologies. The company’s Calibre 3DSTACK solution is also certified for use with TSMC’s 3DFabric technologies and the 3Dblox standard, supporting silicon stacking and packaging design.
Siemens and TSMC are extending tool certifications to support the newly announced TSMC N3C technology, building on existing N3P solutions. They have also begun work on design enablement for TSMC’s A14 technology to support future design requirements.
The Siemens and TSMC partnership significantly advances system and semiconductor design for AI, automotive, hyperscale, mobile and other key applications, due in part to the following recent technology achievements:
- Siemens’ signature Calibre nmPlatform software is now certified for TSMC’s most advanced processes: Calibre DRC, LVS, PERC, and YieldEnhancer software with SmartFill are certified for TSMC’s N2P and A16 processes, allowing customers to use these tools for signoff in advanced technology nodes. Siemens’ CalibrexACT software is now also certified for the newest version of TSMC’s N2P process.
- As the 3Dblox technology continues its transition to become an IEEE standard, Siemens and TSMC successfully collaborated to certify Siemens’ Calibre 3DSTACK solution’s support for the 3Dblox and TSMC’s 3DFabric technologies. This certification continues the ongoing collaboration on thermal analysis for TSMC’s 3DFabric silicon stacking and advanced packaging technologies. Siemens’ Innovator3D IC solution can support the 3Dblox language format across abstraction levels.
- Siemens’ Analog FastSPICE (AFS) software is now certified for TSMC’s N2P and A16 processes, supporting analog, mixed-signal, RF, and memory design needs. As part of TSMC’s N2 custom design reference flow, AFS also works with TSMC’s Reliability Aware Simulation technology to address factors such as IC aging and self-heating. Additionally, the N2P reference flow includes Siemens’ Solido Design Environment for variation-aware verification.
- Siemens also worked with TSMC through its Calibre 3DStack and AFS technologies to develop design solutions for TSMC’s Compact Universal Photonic Engines (COUPE) platform by combining Siemens’ expertise and TSMC’s advanced process technologies.
- Additionally, Siemens is in the process of certification for its Aprisa software and mPower software on TSMC’s N2P process, aiming to deliver physical implementation and electromigration/IR-drop analysis for both analog and digital designs.
Siemens EDA and TSMC have successfully certified seven sign-off production flows on cloud, including Siemens’ Solido SPICE, Analog FastSPICE, Calibre nmDRC and Calibre YieldEnhancer with SmartFill technology, Calibre nmLVS, Calibre PERC, Calibre xACT, and mPower power integrity analysis flow tools. These offerings have been verified to run with exceptional accuracy and security on the AWS Cloud.
For more information, visit siemens.com.
