Based in Wichita, KS, 3P Processing delivers one-stop surface metal processing and finishing solutions for aluminum, titanium, and steel components. The company’s specialized services include masking, prime, & topcoat, chemical processing, non-destructive testing, shot peening, and other ancillary services. 3P is a critical provider to the aerospace sector supporting the commercial, business aviation and defense sectors. 3P Processing maintains multiple NADCAP certifications, as well as over 20 OEM approvals from companies including Boeing, Gulfstream, Lockheed Martin, Sikorsky, Cessna, and Raytheon Technologies, among others.

Baker Hostetler served as Littlejohn Capital’s legal counsel. KAL Capital served as financial advisor to 3P Processing.

For more information, visit littlejohncapital.com.

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Siemens and TSMC are extending tool certifications to support the newly announced TSMC N3C technology, building on existing N3P solutions. They have also begun work on design enablement for TSMC’s A14 technology to support future design requirements.

The Siemens and TSMC partnership significantly advances system and semiconductor design for AI, automotive, hyperscale, mobile and other key applications, due in part to the following recent technology achievements:

• Siemens’ signature Calibre nmPlatform software is now certified for TSMC’s most advanced processes: Calibre DRC, LVS, PERC, and YieldEnhancer software with SmartFill are certified for TSMC’s N2P and A16 processes, allowing customers to use these tools for signoff in advanced technology nodes. Siemens’ CalibrexACT software is now also certified for the newest version of TSMC’s N2P process.
• As the 3Dblox technology continues its transition to become an IEEE standard, Siemens and TSMC successfully collaborated to certify Siemens’ Calibre 3DSTACK solution’s support for the 3Dblox and TSMC’s 3DFabric technologies. This certification continues the ongoing collaboration on thermal analysis for TSMC’s 3DFabric silicon stacking and advanced packaging technologies. Siemens’ Innovator3D IC solution can support the 3Dblox language format across abstraction levels.
• Siemens’ Analog FastSPICE (AFS) software is now certified for TSMC’s N2P and A16 processes, supporting analog, mixed-signal, RF, and memory design needs. As part of TSMC’s N2 custom design reference flow, AFS also works with TSMC’s Reliability Aware Simulation technology to address factors such as IC aging and self-heating. Additionally, the N2P reference flow includes Siemens’ Solido Design Environment for variation-aware verification.
• Siemens also worked with TSMC through its Calibre 3DStack and AFS technologies to develop design solutions for TSMC’s Compact Universal Photonic Engines (COUPE) platform by combining Siemens’ expertise and TSMC’s advanced process technologies.
• Additionally, Siemens is in the process of certification for its Aprisa software and mPower software on TSMC’s N2P process, aiming to deliver physical implementation and electromigration/IR-drop analysis for both analog and digital designs.

Siemens EDA and TSMC have successfully certified seven sign-off production flows on cloud, including Siemens’ Solido SPICE, Analog FastSPICE, Calibre nmDRC and Calibre YieldEnhancer with SmartFill technology, Calibre nmLVS, Calibre PERC, Calibre xACT, and mPower power integrity analysis flow tools. These offerings have been verified to run with exceptional accuracy and security on the AWS Cloud.

For more information, visit siemens.com.

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The President’s Award honors individuals for their significant contributions, leadership, and long-term service to AMUG. To date, only twelve of these awards have been given.

Lopes’ first AMUG Conference was in 2010, and he has been a vigilant contributor and advocate in all the years that followed. For his early work, he received the coveted DINO (Distinguished INnovator Operator) Award in 2012. In the following years, Lopes served as a chair or member of several AMUG Committees, including DINO Selection, New Members, and Technical Competition.

Promoted to chief technical officer at Gentle Giant Studios 15 months after joining the company in 2022, Lopes’ journey into the blending of technology and creativity started at Stan Winston Studio and expanded at Legacy Effects. After 11 years, he moved to Carbon, a supplier of additive manufacturing solutions, to help customers ‘connect the dots’ between the technology and their applications. Lopes served as chair for SPE AM & 3D Printing, coincident with his time at Gentle Giant Studios. Presently, he is a board advisor for Axtra3D, Inc.

Since his first appearance on the AMUG stage in 2012, Lopes has enthralled AMUG Members with presentations illustrating the use of additive manufacturing in creative works, such as movie props, suits, characters, and special effects. These presentations, seven in total, include four as the keynote speaker.

Past recipients of the President’s Award are Thomas A. Sorovetz (2000), Patti Brown (2006), Guy E. Bourdeau (2007), Robert Zubrickie (2010), Timothy Gornet (2013), Gary Rabinovitz (2014), Mark Abshire (2016), Elizabeth Goode (2019), Terry Hoppe (2021), Vince Anewenter (2021), and Mark Wynn (2023).

For more information, visit amug.com.

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AMUG representatives presented the DINO Awards in recognition of tenure in the additive manufacturing industry, years of service, contributions to the industry, and active support of AMUG and its conference.

The newly named AMUG DINOs are:

• Amy Alexander, Mayo Clinic
• Dan Braley, Boeing Global Services
• Patrick Gannon, Ricoh USA, Inc.
• Ryan Kircher, rms Company
• Dallas Martin, Toyota
• Brennon White, General Motors

The new DINOs have contributed in various ways to support AMUG and the AMUG Conference by helping attendees access information, share insights, and build connections. While each recipient has made multiple contributions, the selection committee highlighted specific activities that led to the DINO Awards.

Amy Alexander’s accomplishments and recognitions are plentiful, and she has graciously shared her experiences to encourage awareness and adoption.

Receiving a DINO award is not the final goal for those recognized by the DINO Selection Committee. Rather, it marks an important point in their ongoing contributions to the community.

Over its 38-year history, AMUG has awarded only 199 DINOs. LeMaster noted that 69 DINOs spanning 24 years were present at AMUG 2025, representing 35 percent of all that have received this recognition. Another demonstration of ongoing commitment is that seven current AMUG Board members received DINOs 2 to 24 years prior.

AMUG’s guiding principle is ‘For Users. By Users.’ The newly named DINOs and all that came before them put this philosophy into action.

Nominations for 2026 DINO candidates will be accepted beginning October 1, 2025.

For more information, visit amug.com.

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The prestigious award recognizes Elevāt’s leadership in delivering enterprise-scale IoT solutions that drive measurable outcomes for off-highway equipment manufacturers, fleet operators, and service providers. Elevāt’s platform—deployed across tens of thousands of machines globally—empowers OEMs to optimize uptime, streamline diagnostics, and unlock new service revenue through real-time machine data and AI-powered insights.

Compass Intelligence’s Spring Technology awards honor companies and executives demonstrating excellence and vision across the connected technologies ecosystem. Winners are selected by a panel of analysts, editors, journalists, marketing, and industry influencers.

The award recognizes Elevāt’s ongoing efforts to expand its global reach and support industrial OEMs with connected machine solutions. The company currently has thousands of machines in operation worldwide, contributing to the development of enterprise-level machine connectivity and digital services.

For more information, visit elevat-iot.com.

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Additionally, KDDI and AMD will undergo validation and testing efforts to further enhance KDDI 5G core networks. As technology partners, the two companies aim to contribute to the improvement of the KDDI customer experience and the development of energy efficient solutions to power 5G network and next-gen communication infrastructure in the era of AI.

For more information, visit amd.com.

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Rescale’s early investors include Sam Altman, Jeff Bezos, Paul Graham, and Peter Thiel. The company is on a mission to empower the world’s leading engineers and R&D teams with advanced computing, intelligent data management, and applied AI.

In response to greater demand for new innovative products, enterprises are increasing their investments in technologies that expedite time to market. High-performance computing has grown to a $50 billion market, product lifecycle data management a $30 billion market, and simulation software a $20 billion market. With the growing adoption of these solutions in the enterprise, teams are challenged to integrate the increasingly complex stack of software, hardware, and data systems into a unified control plane and user experience. Further, applied AI solutions are advancing rapidly, but most organizations lack a cohesive platform to embed these capabilities into the analysis, modeling, and simulation workflows for physics, chemistry, and biology. Rescale offers a comprehensive platform for integrating compute, data, and AI capabilities into a seamless experience, enabling organizations to focus on innovation and discovery. 

Rescale is trusted by industry leaders advancing the frontier in aerospace, automotive, energy, life sciences, manufacturing, public sector, and semiconductors. The company’s hundreds of enterprise customers — which include Arm, General Motors Motorsports, Samsung, SLB, and the U.S. Department of Defense — spend over $1 billion annually in high-performance computing infrastructure to power their virtual product development and scientific discovery environments. Rescale supports a diverse array of mission-critical use cases, such as accelerating drug development through molecular analysis, optimizing aircraft aerodynamics and enhancing automotive safety through crash simulations. Rescale enables innovators and scientists to bring more advanced products to market with greater efficiency.

Rescale’s new funding will expedite growth of its comprehensive digital engineering platform for advanced computing, intelligent data, and applied AI. To support the increasing demand for its platform, Rescale is accelerating the delivery of its roadmap including:

• Expanding the range of new workflows and computing technologies available to its customers; growing its market-leading library of over 1,250 applications and global network of more than 500 cloud datacenters with its technology partners such as AMD, Amazon Web Services, Arm, Intel, Microsoft Azure, NVIDIA, and Oracle Cloud Infrastructure. 
• Establishing unified data fabric and digital thread capability for all modeling and simulation workflows, along with AI-native search, tagging, and automation; while expanding on robust enterprise security and compliance offerings, including additional authorizations for government and defense customers. 
• Empowering industrial enterprises for the next era of AI-powered engineering, enabling organizations to democratize and automate the use of industry-leading AI Physics tools and libraries, resulting in over 1000x speed improvements in design validation.

Rapid advancements in AI technologies are changing how every organization seeks to gain a competitive edge. Rescale’s digital engineering platform is reimagining modeling and simulation for the AI era. Rescale’s cloud-native technologies provide enterprises with agility and automation that fundamentally advance product development and scientific discovery.

For more information, visit rescale.com.

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Autodesk and Starboard have entered into an Information Sharing and Discussion Agreement to facilitate ongoing collaboration towards the goal of driving sustainable value creation for all shareholders.

In addition to the board appointments, as part of the cooperation agreement, Starboard will withdraw its director nominees and has agreed to customary standstill, voting and other provisions.

For more information, visit autodesk.com.

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Faraday’s FlashKit-22RRAM platform is an energy-efficient SoC platform implemented on UMC’s 22ULP process technology, supporting both Arm Cortex-M7 and the VeeR EH1 RISC-V processors. It features multiple systems, analog, and interface blocks as well as eNVM and the QuickLogic eFPGA IP for post-tape-out customization. The FlashKit platform series is tailored for system companies designing AIoT, consumer, and industrial applications, where integration and performance efficiency is required. The SoC in the FlashKit platform includes all the building blocks IoT system developers would use in their own SoC. Furthermore, the FlashKit platform enables users to make architectural tradeoffs between functions implemented on different subsystems – from software on processors to RTL on eFPGA to hard logic.

With the inclusion of QuickLogic’s well-established and silicon-proven eFPGA technology, FlashKit now enables customers to adapt hardware functionality post-silicon, significantly reducing time-to-market while extending product lifecycles through field upgradability.

QuickLogic’s eFPGA IP offers a scalable architecture and is built on open-source toolchains, empowering developers with a high degree of design freedom. The addition of this reconfigurable logic within the FlashKit platform lets Faraday customers optimize power, performance, and area (PPA) for their unique workloads — an essential advantage for edge AI and real-time sensor fusion applications.

For more information, visit quicklogic.com.

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Boeing will retain core digital capabilities that harness both aircraft and fleet-specific data to provide commercial and defense customers with fleet maintenance, diagnostics and repair services. This digital expertise will continue to provide predictive and prognostic maintenance insights.

Approximately 3,900 employees around the globe work in Boeing’s Digital Aviation Solutions organization, which includes elements of the business remaining within Boeing and those included in the sale. Boeing is working with Thoma Bravo to help ensure as seamless of a transition as possible for employees while continuing to meet the needs of customers in accordance with all obligations.

The transaction is expected to close by the end of 2025 and is subject to regulatory approval and customary closing conditions.

Citi is acting as exclusive financial advisor to Boeing, and Mayer Brown LLP is acting as outside counsel. Kirkland & Ellis LLP is acting as legal counsel to Thoma Bravo.

For more information, visit boeing.com.

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