Designed for versatility, DeepRoute.ai VLA model supports both camera-only solution and LiDAR-camera fusion configurations, compatible with various automotive computing platforms. Multiple AI vehicle models integrated with DeepRoute.ai’s VLA model are set to release in 2025.

Liwei Yang, General Manager of Volcano Engine Automotive and Head of the Institute of Intelligent Mobility and Embodied AI, also expressed his confidence in the collaboration and strong anticipation for DeepRoute.ai’s VLA model to enter the market soon.

This advanced system excels in long-context understanding, analyzing driving scenarios over extended time frames of up to dozen seconds. It provides step-by-step explanations of its decision-making process, offering insights into its surroundings, predictions and planned actions. By enhancing both performance and transparency, the VLA model fosters greater trust in smart driving technology.

At Auto Shanghai 2025, DeepRoute.ai is showcasing its latest smart driving advancements, the VLA model and RoadAGI strategy at exhibition booth 8BD012. CEO Maxwell Zhou is also attending the panel on the stage, sharing insights into the company’s vision for expanding AI-driven mobility.

For more information, visit deeproute.ai.

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Engineered for advanced automation tasks, the FPC-5211 supports powerful edge computing for real-time data processing and AI inference. Ideal for machine vision and smart city applications, it handles data from multiple sources—LiDAR, industrial cameras, traffic sensors—with low latency and high efficiency. This platform recently earned the Best in Show award from Embedded Computing Design at Embedded World 2025.

Designed for flexible industrial deployment, the ARES-1983H series features a din-rail mount and EzIO modular I/O system, allowing customers to easily customize configurations for factory automation, process control, and machine interfacing.

ARBOR introduces the ARTS-1670 and SB-244-RPLU for autonomous mobile robots (AMR) and automated guided vehicles (AGV). Engineered for performance and durability, these systems meet the rigorous demands of real-time navigation, sensor integration, and operational control in dynamic environments.

Built for real-time video and language model (VLM) applications, the AEC-6100 delivers top-tier AI performance at the edge. Ideal for smart surveillance, automated inspection, and robotics, it reduces latency and enhances on-site processing without compromising security.

Powered by Intel Core Ultra processors, the IEC-3714 delivers 34 TOPS of AI performance in NUC size. It supports real-time video analytics for age, gender, and object recognition, enabling automated decision-making for promotions, restocking, and customer engagement.

With its MediaTek MT8781 processor and Android 14 OS, the Ruby 10 is built for mobility, featuring Wi-Fi 6E, 4G connectivity, and hot-swappable batteries for 24/7 operation. Designed for retail and logistics, it supports NFC payments, and has IP65 and 1.2m drop certifications for dependable performance in harsh environments.

ARBOR will also unveil its latest computer-on-module solution, offering exceptional computing scalability based on Intel’s Core Ultra and Arrow Lake platforms. These modules are optimized for embedded applications requiring compact, high-performance solutions with broad customization options.

For more information, visit arbor-technology.com.

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AI processing requires the transmission of vast data volumes between graphics processing unit (GPU) semiconductors and memory. As semiconductor performance increases, the memory installed is also required to have high-speed, high-frequency, and high-density data transfer capabilities. HBM features a stacked DRAM structure, requiring technology capable of fabricating wafers even more thinly and precisely. This configuration also requires that the PCBs used in inspection equipment meet even higher levels of performance and quality.

Since the latest semiconductors process an enormous number of signals and the number of wafer-mounted chips increases due to process miniaturization, it is necessary to increase density and more layers on the PCBs used in inspection equipment. Nevertheless, PCB thickness has been limited to 7.6 mm due to various constraints, and 108 layers was the maximum limit with conventional technology. This time, by developing ultra-thin materials and tools and handling technologies suitable for ultra-thin materials, together with developing and introducing a proprietary automatic transport system for ultra-thin materials into its production line, OTC has successfully developed 124-layer PCB technology with a board thickness of 7.6 mm.

OKI continues to focus on its EMS business, providing manufacturing services that include design, production, and reliability testing. The company emphasizes technology development in the PCB sector and developed this new technology to address expected growth areas such as AI semiconductors, aerospace, defense, robotics, and next-generation communications. OKI plans to further develop PCBs and manufacturing technologies in line with future technological advancements.

Note 1: HBM (High Bandwidth Memory)
Next-generation high-bandwidth memory. Consists of multiple stacked DRAM with a dedicated high-speed interface.
Note 2: DRAM (Dynamic Random Access Memory)
A type of temporary data storage memory widely used in computers and electronic devices, made up of cells consisting of capacitors that hold electric charge and transistors to control this charge. As volatile memory, this memory loses data when power supply is cut off. In addition, it allows for high-speed data read/write and is well-suited for increased capacity. It is used in personal computers, servers, mobile devices, etc.

For more information, visit oki.com.

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Greenville Technical College earned this award for its innovative advanced manufacturing, transportation, and technology (AMTT) programs, which are distinguished by strong industry partnerships, state-of-the-art facilities, and a comprehensive, industry-aligned curriculum. The success of these initiatives is reflected in Greenville Technical College’s strong job placement rates—89% of Automotive & Diesel Technology graduates find employment within six months, while the Advanced Manufacturing and CNC Machining program boasts a 93% job placement rate.

Other key highlights of Greenville Technical College’s workforce development initiatives include:

• Comprehensive program offerings – Features stackable credentials and diverse pathways across manufacturing, engineering, and transportation fields.
• Focus on emerging technologies – Incorporates industrial IoT, smart factory automation, and rapid prototyping into curriculum.
• Commitment to non-traditional learners – Supports veterans, single parents, and previously incarcerated individuals to expand workforce access.

Greenville Technical College’s AMTT programs emphasize experiential learning, career readiness, and employer engagement. By working closely with regional manufacturers, businesses, and industry leaders, graduates are equipped with the technical expertise and critical problem-solving skills necessary for today’s evolving industry.

As the first recipient of the Workforce Development Innovations Award, Greenville Technical College sets a high standard for future honorees. SME created this award to celebrate organizations that drive meaningful change in workforce training and education, ensuring a strong pipeline for manufacturing in North America.

For more information, visit sme.org.

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Based in Wichita, KS, 3P Processing delivers one-stop surface metal processing and finishing solutions for aluminum, titanium, and steel components. The company’s specialized services include masking, prime, & topcoat, chemical processing, non-destructive testing, shot peening, and other ancillary services. 3P is a critical provider to the aerospace sector supporting the commercial, business aviation and defense sectors. 3P Processing maintains multiple NADCAP certifications, as well as over 20 OEM approvals from companies including Boeing, Gulfstream, Lockheed Martin, Sikorsky, Cessna, and Raytheon Technologies, among others.

Baker Hostetler served as Littlejohn Capital’s legal counsel. KAL Capital served as financial advisor to 3P Processing.

For more information, visit littlejohncapital.com.

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Siemens and TSMC are extending tool certifications to support the newly announced TSMC N3C technology, building on existing N3P solutions. They have also begun work on design enablement for TSMC’s A14 technology to support future design requirements.

The Siemens and TSMC partnership significantly advances system and semiconductor design for AI, automotive, hyperscale, mobile and other key applications, due in part to the following recent technology achievements:

• Siemens’ signature Calibre nmPlatform software is now certified for TSMC’s most advanced processes: Calibre DRC, LVS, PERC, and YieldEnhancer software with SmartFill are certified for TSMC’s N2P and A16 processes, allowing customers to use these tools for signoff in advanced technology nodes. Siemens’ CalibrexACT software is now also certified for the newest version of TSMC’s N2P process.
• As the 3Dblox technology continues its transition to become an IEEE standard, Siemens and TSMC successfully collaborated to certify Siemens’ Calibre 3DSTACK solution’s support for the 3Dblox and TSMC’s 3DFabric technologies. This certification continues the ongoing collaboration on thermal analysis for TSMC’s 3DFabric silicon stacking and advanced packaging technologies. Siemens’ Innovator3D IC solution can support the 3Dblox language format across abstraction levels.
• Siemens’ Analog FastSPICE (AFS) software is now certified for TSMC’s N2P and A16 processes, supporting analog, mixed-signal, RF, and memory design needs. As part of TSMC’s N2 custom design reference flow, AFS also works with TSMC’s Reliability Aware Simulation technology to address factors such as IC aging and self-heating. Additionally, the N2P reference flow includes Siemens’ Solido Design Environment for variation-aware verification.
• Siemens also worked with TSMC through its Calibre 3DStack and AFS technologies to develop design solutions for TSMC’s Compact Universal Photonic Engines (COUPE) platform by combining Siemens’ expertise and TSMC’s advanced process technologies.
• Additionally, Siemens is in the process of certification for its Aprisa software and mPower software on TSMC’s N2P process, aiming to deliver physical implementation and electromigration/IR-drop analysis for both analog and digital designs.

Siemens EDA and TSMC have successfully certified seven sign-off production flows on cloud, including Siemens’ Solido SPICE, Analog FastSPICE, Calibre nmDRC and Calibre YieldEnhancer with SmartFill technology, Calibre nmLVS, Calibre PERC, Calibre xACT, and mPower power integrity analysis flow tools. These offerings have been verified to run with exceptional accuracy and security on the AWS Cloud.

For more information, visit siemens.com.

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The President’s Award honors individuals for their significant contributions, leadership, and long-term service to AMUG. To date, only twelve of these awards have been given.

Lopes’ first AMUG Conference was in 2010, and he has been a vigilant contributor and advocate in all the years that followed. For his early work, he received the coveted DINO (Distinguished INnovator Operator) Award in 2012. In the following years, Lopes served as a chair or member of several AMUG Committees, including DINO Selection, New Members, and Technical Competition.

Promoted to chief technical officer at Gentle Giant Studios 15 months after joining the company in 2022, Lopes’ journey into the blending of technology and creativity started at Stan Winston Studio and expanded at Legacy Effects. After 11 years, he moved to Carbon, a supplier of additive manufacturing solutions, to help customers ‘connect the dots’ between the technology and their applications. Lopes served as chair for SPE AM & 3D Printing, coincident with his time at Gentle Giant Studios. Presently, he is a board advisor for Axtra3D, Inc.

Since his first appearance on the AMUG stage in 2012, Lopes has enthralled AMUG Members with presentations illustrating the use of additive manufacturing in creative works, such as movie props, suits, characters, and special effects. These presentations, seven in total, include four as the keynote speaker.

Past recipients of the President’s Award are Thomas A. Sorovetz (2000), Patti Brown (2006), Guy E. Bourdeau (2007), Robert Zubrickie (2010), Timothy Gornet (2013), Gary Rabinovitz (2014), Mark Abshire (2016), Elizabeth Goode (2019), Terry Hoppe (2021), Vince Anewenter (2021), and Mark Wynn (2023).

For more information, visit amug.com.

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AMUG representatives presented the DINO Awards in recognition of tenure in the additive manufacturing industry, years of service, contributions to the industry, and active support of AMUG and its conference.

The newly named AMUG DINOs are:

• Amy Alexander, Mayo Clinic
• Dan Braley, Boeing Global Services
• Patrick Gannon, Ricoh USA, Inc.
• Ryan Kircher, rms Company
• Dallas Martin, Toyota
• Brennon White, General Motors

The new DINOs have contributed in various ways to support AMUG and the AMUG Conference by helping attendees access information, share insights, and build connections. While each recipient has made multiple contributions, the selection committee highlighted specific activities that led to the DINO Awards.

Amy Alexander’s accomplishments and recognitions are plentiful, and she has graciously shared her experiences to encourage awareness and adoption.

Receiving a DINO award is not the final goal for those recognized by the DINO Selection Committee. Rather, it marks an important point in their ongoing contributions to the community.

Over its 38-year history, AMUG has awarded only 199 DINOs. LeMaster noted that 69 DINOs spanning 24 years were present at AMUG 2025, representing 35 percent of all that have received this recognition. Another demonstration of ongoing commitment is that seven current AMUG Board members received DINOs 2 to 24 years prior.

AMUG’s guiding principle is ‘For Users. By Users.’ The newly named DINOs and all that came before them put this philosophy into action.

Nominations for 2026 DINO candidates will be accepted beginning October 1, 2025.

For more information, visit amug.com.

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The prestigious award recognizes Elevāt’s leadership in delivering enterprise-scale IoT solutions that drive measurable outcomes for off-highway equipment manufacturers, fleet operators, and service providers. Elevāt’s platform—deployed across tens of thousands of machines globally—empowers OEMs to optimize uptime, streamline diagnostics, and unlock new service revenue through real-time machine data and AI-powered insights.

Compass Intelligence’s Spring Technology awards honor companies and executives demonstrating excellence and vision across the connected technologies ecosystem. Winners are selected by a panel of analysts, editors, journalists, marketing, and industry influencers.

The award recognizes Elevāt’s ongoing efforts to expand its global reach and support industrial OEMs with connected machine solutions. The company currently has thousands of machines in operation worldwide, contributing to the development of enterprise-level machine connectivity and digital services.

For more information, visit elevat-iot.com.

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Additionally, KDDI and AMD will undergo validation and testing efforts to further enhance KDDI 5G core networks. As technology partners, the two companies aim to contribute to the improvement of the KDDI customer experience and the development of energy efficient solutions to power 5G network and next-gen communication infrastructure in the era of AI.

For more information, visit amd.com.

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