A16 EM/IR and thermal certification

RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC’s advanced silicon process A16 with Super Power Rail, a best-in-class backside power delivery solution for analog/block-level and SoC-level electromigration (EM) and voltage drop (IR) analysis.

To ensure reliable thermal management for the TSMC A16 process, Ansys and TSMC developed a more precise thermal analysis flow. The enhanced method leverages TSMC’s thermal specifications, providing accurate temperature calculations, and enhancing performance in advanced applications. In addition, Ansys and TSMC continue collaborating on design enablement for TSMC’s next-generation A14 technology.

Advanced 5nm and 3nm on-chip electromagnetic certification

To address growing needs for scalable electromagnetic analysis, Ansys is introducing the HFSS-IC product family. HFSS-IC Pro, which incorporates RaptorX technology, has been certified by TSMC for its 5nm and 3nm process technologies. The certification supports the use of the tool in designing advanced semiconductor products for applications such as AI, high-performance computing, next-generation communications, and automotive electronics. 

AI-assisted photonic design optimization

Ansys and TSMC continue to refine COUPE design solutions by leveraging AI capabilities in Ansys optiSLang process integration and design optimization software. These solutions enable PIC optimization with Ansys Lumerical INTERCONNECT and empower optical coupling system optimization and robustness analysis with Ansys Zemax OpticStudio.

AI-assisted optimal RF design migration

TSMC, Ansys, and Synopsys have improved a joint AI-assisted workflow for RF integrated circuit migration. The solution combines Ansys HFSS-IC Pro AI technology with Synopsys Custom Compiler and ASO.ai tools to support the transition between silicon process nodes for analog and RF ICs. The workflow automates tasks such as device placement, routing optimization, and EM-aware tuning while maintaining design intent and performance. As process nodes advance, RF IC migration becomes more complex. Integrating AI helps address electromagnetic challenges, supporting signal integrity, power efficiency, and manufacturability. 

Multiphysics signoff analysis flow enablement

Ansys RedHawk-SC, RedHawk-SC Electrothermal, and Synopsys 3DIC Compiler are integrated into TSMC, Ansys, and Synopsys’ joint multiphysics signoff analysis flow enablement platform for extraction, timing, power, EM/IR, and thermal analysis. These analyses are linked through a shared data flow, supporting thermal-aware timing analysis and voltage-aware timing analysis. This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs.

For more information, visit ansys.com.

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The deployment will support the full development process for all Airbus civil and military aircraft and helicopters. It will enable over 20,000 users across business units and suppliers to collaborate more efficiently using virtual twins, either on-premise or on a sovereign cloud. The goal is to streamline development, improve production processes, and support aftersales services while managing costs.

Dassault Systèmes will provide Airbus with seven industry solution experiences based on the 3DEXPERIENCE platform:  “Program Excellence,” “Winning Concept,” “Co-Design to Target,” “Cleared to Operate,” “Ready for Rate,” “Build to Operate,” and “Keep Them Operating.”

For more information, visit 3ds.com.

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ZEN, which stands for ZEISS Efficient Navigation, is designed to support microscopists in acquiring and managing imaging data. Users in fields such as materials research, natural resources, electronics, and life sciences can carry out microscopy workflows suited to their laboratory needs. The software facilitates image acquisition, analysis, and data organization.

ZEISS ZEN core now includes basic control of SEMs and FIB-SEMs. Both non-experts and experienced professionals benefit from the integration of SEM imaging and EDS analytics, as well as enhancements in AI-based workflows. FIB-SEM users can maximize throughput reliably by using the fully automated TEM lamella preparation.

ZEN core enables end-to-end workflows by seamlessly integrating ZEISS light microscopes and SEMs, allowing users to easily operate their instruments and conduct multi-modal experiments through a single, intuitive, and streamlined graphical user interface (GUI).

More efficiency with Navigation Workspace

ZEN core presents a unique concept featuring a central Navigation Workspace, allowing for easy navigation and intuitive operation.

The Navigation Workspace is designed to guide user workflows. Users can easily access essential electron microscopy (EM) control parameters through the top navigation tools, gaining a comprehensive overview of the entire sample holder and all samples. Additionally, they can collect acquired data in an image gallery while simultaneously controlling their live image.

More flexibility with customizable workbenches

Users can create task-specific workbenches that display only the controls necessary for routine workflows, guiding operators through a defined sequence of tasks. This functionality ensures data repeatability and reliability, particularly in multi-user environments and for inexperienced users.

A software suite for connected microscopy

ZEISS ZEN core enhances laboratory productivity by providing a solution that connects data from different microscopes. This connectivity delivers more meaningful insights from correlative, multi-scale, and multi-modal experiments.

With robust database connectivity features, ZEISS ZEN core enables users to keep their data organized across instruments, laboratories, and locations, facilitating efficient data management and retrieval.

Streamlined and simplified SEM workflows

Whether users are conducting routine image acquisition or advanced analysis, ZEISS ZEN core maximizes technical performance while providing an intuitive and configurable interface that grants access to all parameters and functions.

The software suite is now available for the ZEISS EVO, Sigma, GeminiSEM, and Crossbeam families.

For more information, visit zeiss.com.

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Key features of the OX01N1B include industry-leading NIR quantum efficiency (QE) at 36% for excellent low-light performance, a high modulation transfer function (MTF) for better image quality and resolution, low power consumption, and an optical format that enables extremely compact camera module design. The OX01N1B uses OmniPixel4-GS technology for simultaneous image detection in all pixels to accurately reproduce rapid motion without any distortions.

The OX01N1B has integrated ASIL-B and cybersecurity that meet the latest industry standards. It comes in an OMNIVISION a-CSP package, allowing for higher-performance image sensors in tighter camera spaces. It is available in a reconstructed wafer option for designers who want to assemble a bare die imager into their camera module.

The OX01N1B is available for sampling now and will be in mass production in Q3 2026.

For more information, visit ovt.com.

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EOS, which has a broad installed base of additive manufacturing (AM) systems in the space technology sector, has partnered with established space organizations to provide AM solutions aligned with industry-specific needs. The collaboration focuses on supporting the aviation and space sector in India through AM-based design and production of functionally improved components.

Together, Godrej Enterprises Group and EOS will build the technical capabilities and production capacities required to establish a robust AM-based aviation and space supply chain to serve Indian and global original equipment manufacturers (OEMs). As a first step, the partners will pursue the application of large-scale multi-laser AM technology for production.

Since its first launch in 1963, India has steadily advanced in space technology, achieving milestones such as reaching Mars’ orbit on its first attempt, successfully landing on the Moon’s south pole, and completing its 100th launch. As the country’s space industry continues to grow, the aerospace business of Godrej Enterprises Group has played a role in supporting these developments. At its manufacturing facilities for cryogenic engine assemblies and satellite thrusters, G&B carries out key assembly processes that contribute to India’s space programs.

EOS views India as a significant manufacturing hub and is focused on bringing its experience and competency to facilitate India’s space ambitions. The EOS/Godrej Enterprises Group MoU is another strategic step towards implementing AM in the Indian aviation and space industry and helps Godrej – as its AM technology enablement partner – ensure their readiness for both current and upcoming novel programs.

For more information, visit eos.info.

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The why: bridging the critical gap between traditional higher education and AI-economy requirements

Traditional university structures have changed gradually over time, but many aspects still reflect longstanding models. This has contributed to a growing gap between how education is delivered and the changing skill demands of an economy influenced by AI. While technology has reshaped many industries, the pace of change in higher education has been slower, which may affect how well graduates are prepared for roles where cognitive automation is becoming more common.

This educational transformation gap represents an inflection point for both learners and institutions. As artificial intelligence and automation reshape the global economy, university systems must evolve dramatically to prepare students for a future where distinctively human capabilities become increasingly valuable.

The what: a comprehensive spatial AI ecosystem for higher education transformation

The Spatial AI University offers an unparalleled, integrated solution specifically designed to transform university education across academic disciplines:

First comprehensive higher education spatial AI implementation

Unlike fragmented educational technology initiatives, the Spatial AI University provides a complete transformation platform spanning all academic domains, degree levels, and educational frameworks, creating learning environments that develop critical future-ready skills.

EON-XR platform and enterprise-grade spatial AI

• Secure, scalable platform enables immersive learning delivery across devices
• Works on smartphones, tablets, computers, and XR headsets
• Spatial AI powers intelligent personalization and adaptive content
• Revolutionary AI content creation transforms traditional academic materials into interactive 3D experiences

Unified Learn-Train-Perform methodology

Every aspect of the University follows EON’s research-validated educational model:

• Learn phase: Accelerate knowledge acquisition through spatial cognition, conceptual visualization, immersive contextualization, and multisensory engagement
• Train phase: Develop capabilities through risk-free experimentation, progressive skill building, real-time feedback, and performance analytics
• Perform phase: Apply knowledge through project-based application, collaborative implementation, outcome documentation, and career pathways

Comprehensive platform components

• EON-XR platform: Cross-device immersive learning environment supporting collaborative education
• EON AI Ready: AI-powered content creation system transforming traditional academic materials into immersive experiences
• EON AI Mentor (Brainy): Personalized AI guides providing 24/7 support and adaptive learning pathways
• EON Vibe Coder: No-code development environment enabling faculty and student application creation
• EON Career Compass: Career guidance system connecting education to employment opportunities
• EON Entrepreneur Guide: Entrepreneurship development framework for innovation and venture creation

The how: immersive learning environment, comprehensive implementation, global distribution

The Spatial AI University transforms abstract academic concepts into tangible, interactive experiences through a carefully structured implementation approach:

Immersive academic experiences

• Spatial understanding: Students manipulate 3D models of complex systems, making abstract concepts visible
• Interactive learning: Practice complex skills in safe environments without physical limitations
• AI-guided education: Receive personalized guidance and adaptive challenge levels based on individual progress
• Collaborative problem-solving: Work with peers in shared virtual spaces on authentic, complex challenges
• Future skills development: Build AI literacy, complex problem-solving, creative innovation, ethical decision-making, and advanced research skills

Phased implementation approach

The implementation follows a structured methodology with clear milestones and measurable outcomes at each stage:

• Foundation phase (Months 1-3): Platform deployment at research and innovation centers, team building, showcase development
• Expansion phase (Months 4-9): Key academic department implementation, content acceleration, faculty certification, student leadership
• Global leadership phase (Months 10-18): International deployment, premium content development, marketplace optimization, research publication

Key benefits of the Spatial AI University

For students

• Accelerated learning through more effective knowledge acquisition methods
• Enhanced engagement through immersive, interactive experiences
• Personalized pathways adapted to individual learning styles and career goals
• Future-ready skills essential for success in an AI-driven economy
• Clear connections between education and future opportunities

For educational partners

• Technological leadership positioning in competitive higher education markets
• Enhanced outcomes with measurable improvements in student success
• Operational efficiency through AI-enhanced teaching and administration
• New revenue streams through premium offerings and content development
• Global recognition as pioneers in educational innovation

Comparison: Traditional university education vs. EON’s Spatial AI University

Comprehensive academic experience highlights

Leveraging spatial AI for dynamic content and personalized learning pathways across academic disciplines:

For sciences

• Physics and engineering: Interactive visualization of complex phenomena from quantum mechanics to structural dynamics
• Chemistry and biology: Molecular-level exploration and manipulation of biochemical processes
• Mathematics: Spatial representation of abstract concepts from multivariable calculus to algorithm visualization
• Environmental sciences: Immersive exploration of ecosystems and natural processes across scales

For humanities and social sciences

• History and anthropology: Immersive historical reconstructions and cultural experiences
• Literature and languages: Interactive narrative spaces and cultural contexts
• Psychology and sociology: Virtual social scenarios and experimental environments
• Economics and political science: Complex system simulations of economic models and political processes

For professional fields

• Medicine: Advanced anatomical visualization and clinical simulations
• Engineering: Interactive modeling and simulation of complex systems
• Business: Realistic business scenarios for strategic decision-making
• Law: Simulated legal environments for advocacy and legal reasoning

Higher education institutions around the world are under increasing pressure to adapt to ongoing technological change. The Spatial AI University offers an alternative approach to preparing students for emerging workforce demands shaped by AI and related technologies.

For more information, visit eonreality.com.

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Based in Warmond, Netherlands, CFD Solutions offers high-quality CFD consultancy and HPC services across multiple industries. CFD Solutions also has extensive experience using HELYX in a wide range of CFD applications, including environmental studies, fire safety, HVAC, maritime, process industry, healthcare, product development and automotive design.

This strategic partnership will enable ENGYS to enhance the quality of the services and support provided with HELYX and deliver their open-source CFD software solutions more effectively to local engineers and companies in the Benelux countries.

For more information, visit engys.com.

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Teamcenter X drives innovation at Workhorse

Workhorse Group Inc., a U.S.-based technology company developing zero-emission commercial vehicles, has adopted Teamcenter X as its standard to improve coordination across development teams and its supply chain as it builds electric trucks for last-mile delivery.

Product availability

Teamcenter X is now available in four offerings:

Teamcenter X Essentials: Designed with ease of deployment and low cost of administration, Teamcenter X Essentials delivers data management for companies focused on mechanical design. It includes CAD data management and product structures with revision management, where used search, check-in/check-out and 3D view and mark-up – while retaining full scalability as an organization grows and evolves.

Teamcenter X Standard: This month, Teamcenter X Standard expands on Teamcenter X Essentials by adding key PLM features such as change management, project scheduling, document management, and report generation. It is delivered with pre-configured settings and can be customized to meet specific customer needs.

Teamcenter X Advanced: Teamcenter X Advanced, also introduced this month, provides support for cross-domain collaboration across mechanical, electrical, and electronic design throughout the product lifecycle. Building on the Standard version, Advanced includes data management for electrical and electronic design integration and classification. Like Standard, it comes with pre-configured settings and can be tailored for customer requirements.

Teamcenter X Premium: Full breadth of PLM and available on choice of cloud provider, Teamcenter X Premium is built for companies who want to harness the full capabilities of Teamcenter in a purpose-built solution to fit their business needs. It covers the full spectrum of Teamcenter’s capabilities, from enterprise BOM and business system integration, model-based systems engineering (MBSE), manufacturing planning, quality and compliance management, product cost and service lifecycle management. The Premium tier also delivers preconfigured solutions tailored for industries such as industrial machinery, medical devices and semiconductor.

To learn more about how Siemens supports manufacturers with flexible and scalable PLM through Teamcenter X, visit plm.sw.siemens.com/en-US/teamcenter/teamcenter-x-cloud-plm/teamcenter-x-plans-and-pricing.

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Creality Cloud is a 3D printing platform developed by Creality. It provides access to over 1 million 3D models, AI-based tools, built-in cloud slicing, and remote printer control within a single app.

Major new features

Revamped model marketplace with a new incentive system

With the new incentive system, designers can now earn points based on the number of downloads and successful prints of their models. These points can be redeemed for Creality 3D printers, gift cards, and more through the Creality Cloud Eshop.

Even for those who don’t create models, they can still earn points by uploading model printing settings, which in turn helps the community and the original creator.

New model boosting feature for higher model visibility

Users can amplify the visibility of the models they downloaded or printed with up to four Boost Tickets per week. Every valid boost also enters the user into exciting prize draws to support their creative endeavors.

AI-powered model discovery and search

A powerful new AI search system allows users to explore Creality Cloud’s extensive library of over 1 million models with unprecedented accuracy. Leveraging semantic AI, it understands user intent rather than simply matching keywords. Users can also search for models by uploading images, making discovery even more intuitive.

Smarter, faster, and more efficient sharing and organization

Spend more time creating and less time organizing. A redesigned upload process now includes smart categorization that automatically recommends the best category, SEO-optimized descriptions, and relevant tags for each model. Additionally, AI image processing can resize cover images to a 1:1 ratio, ensuring consistent and professional-looking thumbnails.

Additionally, a new Insights feature provides real-time performance analytics for every model.

Creality Cloud Version 6.0 is now available on the Google Play Store and Apple App Store.

For more information, visit creality.com.

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V-BOND ink, commonly used with Roland DG’s VersaOBJECT CO-i Series large-format UV flatbeds, is now also available for the MO Series. This expansion supports a wider range of applications for users of benchtop UV printers such as the MO-240 and MO-180.

V-BOND ink offers a durable and versatile option for producing a variety of applications, including indoor and outdoor signage as well as customized products. Its material compatibility supports common uses such as printing coroplast yard signs with MO Series or CO-i Series flatbed printers.

V-BOND ink cures instantly under UV light and produces vibrant, scratch-resistant graphics that adhere well when direct-printed on a vast array of substrates and three-dimensional objects. In addition, V-BOND is nickel-free, CPSIA certified and compliant with California Proposition 65, making it safe for use on children’s toys, lunch boxes, and school supplies as well as pet products, food packaging, and more. It’s also ideal for enhancing electronics, promotional items, awards, giftware, and many other offerings with detailed designs, images, and text.

Available in CMYK, gloss, and white, V-BOND ink is made to bring out the best in VersaOBJECT UV flatbed printers. The CMYK inks combine with the True Rich Color profiles in Roland DG’s VersaWorks RIP software to produce more vibrant reds, natural skin tones, and smooth grayscale, while the gloss and white specialty inks allow users to incorporate stunning dimensional and textural effects into their prints.

VersaOBJECT MO Series models include the MO-240, a highly productive benchtop UV flatbed with a 24” x 18” print area that direct-prints on substrates up to eight inches (203 mm) thick, and the new MO-180, which has an 18” x 12” print area and offers the same great features and capabilities as the MO-240 in a more compact package. VersaOBJECT CO-i Series large-format UV flatbeds include the 30-inch CO-300i-F2 and the 64-inch CO-640i, both of which can print directly on objects up to 9.5 inches (242 mm) thick.

V-BOND inks for VersaOBJECT MO Series UV flatbed printers (available in 750 ml pouches) and VersaOBJECT CO-i Series UV flatbeds (available in 250 ml or 500 ml cartridges) can be purchased through authorized Roland DGA dealers.

For more information, visit rolanddga.com.

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