Puja Mitra

latest from Puja Mitra

AMUG names Technical Competition winners

April 28, 2025

NASA JPL, Equispheres, and Ricoh 3D for Healthcare take top spots in the annual competition.

Siemens, TSMC expand partnership for semiconductor design, integration

April 25, 2025

Jason Lopes receives President’s Award from Additive Manufacturing Users Group

April 25, 2025

Additive Manufacturing Users Group presents DINO awards to six members

April 25, 2025

Trimble expands field-to-office connectivity for heavy civil contractors

April 24, 2025

SMP 37 released for turret punch and cutting machine programming

April 21, 2025

Kraton launches CirKular+ Paving Circularity Series

April 21, 2025

L-com adds new Bulgin products for harsh environment connectivity

April 18, 2025

Bombardier to digitally transform aircraft engineering with Siemens Xcelerator

April 18, 2025

ModuleWorks 2025.04 release available for digital manufacturing

April 18, 2025

Altair names MAIT Group as channel partner

April 18, 2025

Motif expands executive team to support BIM tech development

April 17, 2025

PCBAIR invests in AI to enhance defect prediction in PCB manufacturing

April 17, 2025

Manifest unveils Parallax Volumetric Additive Manufacturing evaluation kit

April 17, 2025

Concepts NREC releases Agile Engineering Design System v2025.1

April 17, 2025

SAIC announces ReadyOne Foundational digital engineering ecosystem

April 17, 2025

Secafy adopts Siemens’ EDA tools for hardware security development

April 16, 2025